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revisions ltr description date (yr-mo-da) approved a drawing updated to reflect current requi rements. - lgt 02-04-18 raymond monnin rev sheet rev sheet rev status rev a a a a a a a a a a a a a a of sheets sheet 1 2 3 4 5 6 7 8 9 10 11 12 13 14 pmic n/a prepared by dan wonnell defense supply center columbus standard microcircuit drawing checked by sandra rooney columbus, ohio 43216 http://www.d scc.dla.mil this drawing is available for use by all departments approved by michael a. frye microcircuit, linear, cmos, 16-bit, 20 khz, a/d converter, monolithic silicon and agencies of the department of defense drawing approval date 92-12-16 amsc n/a revision level a size a cage code 67268 5962-91692 sheet 1 of 14 dscc form 2233 apr 97 5962-e355-02 distribution statement a . approved for public releas e; distribution is unlimited.
standard microcircuit drawing size a 5962-91692 defense supply center columbus columbus, ohio 43216-5000 revision level a sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope . this drawing documents two product assurance class le vels consisting of high reliability (device classes q and m) and space application (device class v). a choice of case outlines and lead finishes are available and are reflected in the part or identifying number (pin). when available, a choice of radiation hardness assurance (rha ) levels are reflected in the pin. 1.2 pin . the pin is as shown in the following example: 5962 - 91692 01 m x x federal stock class designator rha designator (see 1.2.1) device type (see 1.2.2) device class designator case outline (see 1.2.4) lead finish (see 1.2.5) \ / (see 1.2.3) \/ drawing number 1.2.1 rha designator . device classes q and v rha marked devices meet the mil-prf-38535 specified rha levels and are marked with the appropriate rha designator. device class m rha marked devices meet the mil-prf-38535, appendix a specified rha levels and are marked with the appropriate rha designator. a dash (-) indicates a non-rha device. 1.2.2 device type(s) . the device type(s) identify the circuit function as follows: device type generic number circuit function linearity error 01 sei5102a-s 16-bit, 20 khz analog to digital converter 3.0 lsb 02 sei5102a-t 16-bit, 20 khz analog to digital converter 2.0 lsb 1.2.3 device class designator . the device class designator is a single letter identifying the product assurance level as follows: device class device requirements documentation m vendor self-certification to the requirements for mil-std-883 compliant, non- jan class level b microcircuits in accordance with mil-prf-38535, appendix a q or v certification and qualification to mil-prf-38535 1.2.4 case outline(s) . the case outline(s) are as designated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style x gdip1-t28 or cdip2-t28 28 dual-in-line 3 cqcc1-n28 28 square leadless chip carrier 1.2.5 lead finish . the lead finish is as specified in mil-pr f-38535 for device classes q and v or mil-prf-38535, appendix a for device class m.
standard microcircuit drawing size a 5962-91692 defense supply center columbus columbus, ohio 43216-5000 revision level a sheet 3 dscc form 2234 apr 97 1.3 absolute maximum ratings . 1 / 2 / positive digital supply (+v d ) voltage range ........................................... -0.3 v dc to +6.0 v dc 3 / negative digital supply (-v d ) voltage range .......................................... +0.3 v dc to -6.0 v dc positive analog supply (+v a ) voltage range.......................................... -0.3 v dc to +6.0 v dc negative analog supply (-v a ) voltage range ......................................... +0.3 v dc to -6.0 v dc input current, any pi n except supplies .................................................. 10 ma 4 / analog input voltage (ain and vref pins)........................................... (-v a ) ? 0.3 v dc to (+v a ) + 0.3 v dc digital input voltage .............................................................................. -0.3 v dc to (+v a ) + 0.3 v dc storage temperat ure range................................................................... -65 c to +150 c lead temperature (solder ing, 10 sec onds) ........................................... +260 c junction temperature (t j ) ..................................................................... +160 c power dissipation (p d ) .......................................................................... 72 mw thermal resistance, junction-to-case ( jc ) ........................................... see mil-std-1835 thermal resistance, junction-to-ambient ( ja ) case j ............................................................................................... 40 c/w case 3............................................................................................... 60 c/w 1.4 recommended operating conditions . 1 / ambient operating temperature range (t a )........................................... -55 c to +125 c positive digital supply voltage (+v d ) ..................................................... +4.50 v dc to +v a negative digital supply voltage (-v d )..................................................... -4.50 v dc to -5.50 v dc positive analog supply voltage (+v a ).................................................... +4.50 v dc to +5.50 v dc negative analog supply voltage (-v a ) ................................................... -4.50 v dc to -5.50 v dc analog reference voltage (v ref)......................................................... +2.50 v dc to (+v a ) -0.5 v dc analog input voltage range: unipolar............................................................................................. agnd v dc to v ref bipolar ............................................................................................... -v ref to v ref 2. applicable documents 2.1 government specification, standards, and handbooks . the following specification, standards, and handbooks form a part of this drawing to the extent specified herein. unless ot herwise specified, the issues of these documents are those liste d in the issue of the department of defense i ndex of specifications and standards (dodi ss) and supplement thereto, cited in the solicitation. specification department of defense mil-prf-38535 - integrated circuits, manufacturing, general specification for. standards department of defense mil-std-883 - test method standard microcircuits. mil-std-1835 - interface standard electronic component case outlines. 1 / all voltages referenced to agnd and dgnd tied together. 2 / stresses above the absolute maximum rating may cause permanent damage to the device. extended operation at the maximum levels may degr ade performance and affect reliability. 3 / in addition, +v d must not be greater than (+v a ) + 0.3 v dc. 4 / transient currents of up to 100 ma will not cause latch-up.
standard microcircuit drawing size a 5962-91692 defense supply center columbus columbus, ohio 43216-5000 revision level a sheet 4 dscc form 2234 apr 97 handbooks department of defense mil-hdbk-103 - list of standard microcircuit drawings. mil-hdbk-780 - standard microcircuit drawings. (unless otherwise indicated, copies of the specificat ion, standards, and handbooks are ava ilable from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094.) 2.2 order of precedence . in the event of a conflict between the text of th is drawing and the references cited herein, the text of this drawing takes precedence. nothing in this docum ent, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. requirements 3.1 item requirements . the individual item requirements for device classes q and v shall be in accordance with mil-prf-38535 and as specified herein or as modified in the device manufacturer' s quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described herein. the individual item requirements for device class m shall be in accordance with mil-prf-38535, appendix a for non-jan class level b devices and as specified herein. 3.2 design, construction, and physical dimensions . the design, construction, and physica l dimensions shall be as specified in mil-prf-38535 and herein for device classes q and v or mil-prf-38535, appendix a and herein for device class m. 3.2.1 case outline . the case outline shall be in accordance with 1.2.4 herein. 3.2.2 terminal connections . the terminal connections sha ll be as specified on figure 1. 3.2.3 block diagram . the block diagram shall be as specified on figure 2. 3.3 electrical perform ance characteristics and posti rradiation parameter limits . unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as s pecified in table i and shall apply over th e full ambient operating temperature range. 3.4 electrical test requirements . the electrical test requirements shall be the subgroups specified in t able ii. the electrical tests for each subgroup are defined in table i. 3.5 marking . the part shall be marked with the pin listed in 1.2 her ein. in addition, the manufacturer's pin may also be marked as listed in mil-hdbk-103. for pa ckages where marking of the entire smd pi n number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. for rha product using this option, the rha designator shall still be marked. marking for device cl asses q and v shall be in accordance with mil-prf-38535. marking for device class m shall be in accordance with mil-prf-38535, appendix a. 3.5.1 certification/compliance mark . the certification mark for device classes q and v shall be a "qml" or "q" as required in mil-prf-38535. the compliance mark for device class m shall be a "c" as required in mil-prf-38535, appendix a. 3.6 certificate of compliance . for device classes q and v, a certificate of compliance shall be required from a qml-38535 listed manufacturer in order to supply to t he requirements of this drawing (see 6.6.1 herein). for device class m, a certifica te of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in mil-hdbk-103 (see 6.6.2 herein). the certificate of compliance submitted to ds cc-va prior to listing as an approv ed source of supply for this drawing shall affirm that the manufactu rer's product meets, for device classes q and v, the requirements of mil-prf-38535 and herein or for device class m, the requi rements of mil-prf-38535, appendix a and herein. 3.7 certificate of conformance . a certificate of conformance as required for device classes q and v in mil-prf-38535 or for device class m in mil-prf-38535, appendix a shall be provided with each lot of microcircuits delivered to this drawing.
standard microcircuit drawing size a 5962-91692 defense supply center columbus columbus, ohio 43216-5000 revision level a sheet 5 dscc form 2234 apr 97 3.8 notification of change for device class m . for device class m, notification to dscc-va of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in mil-prf-38535, appendix a. 3.9 verification and review for device class m . for device class m, dscc, dscc's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. offs hore documentation shall be made available onshore at the option of the reviewer. 3.10 microcircuit group assignment for device class m . device class m devices covered by this drawing shall be in microcircuit group number 81 (see mil-prf-38535, appendix a). 4. quality assurance provisions 4.1 sampling and inspection . for device classes q and v, sampling and inspection procedures shall be in accordance with mil-prf-38535 or as modified in the device manufacturer's qua lity management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described herein. for device class m, sampling and inspection procedures shall be in accordance with mil-prf-38535, appendix a. 4.2 screening . for device classes q and v, screening shall be in accordance with mil-prf-38535, and shall be conducted on all devices prior to qualification and technology conform ance inspection. for device class m, screening shall be in accordance with method 5004 of mil-std-883, and shall be conduct ed on all devices prior to qua lity conformance inspection. 4.2.1 additional criteria for device class m . a. burn-in test, method 1015 of mil-std-883. (1) test condition d. the test circuit shall be maintai ned by the manufacturer under document revision level control and shall be made available to the preparing or acquiring ac tivity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) t a = +125 c, minimum. b. interim and final electrical test parameter s shall be as specified in table ii herein. 4.2.2 additional criteria for device classes q and v . a. the burn-in test duration, test condi tion and test temperature, or approved alte rnatives shall be as specified in the device manufacturer's qm plan in accordance with mil-prf- 38535. the burn-in test circuit shall be maintained under document revision level control of the device manufacturer' s technology review board (trb) in accordance with mil-prf-38535 and shall be made available to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of mil-std-883. b. interim and final electrical test parameter s shall be as specified in table ii herein. c. additional screening for device class v beyond the require ments of device class q shall be as specified in mil-prf-38535, appendix b.
standard microcircuit drawing size a 5962-91692 defense supply center columbus columbus, ohio 43216-5000 revision level a sheet 6 dscc form 2234 apr 97 table i. electrical per formance characteristics . test symbol conditions -55 c t a +125 c unless otherwise specified group a subgroups device type 1 / limits unit min max resolution for which no missing codes is guaranteed res 2 / 1, 2, 3 all 16 bits integral linearity error inl 2 / 1, 2, 3 01 3.0 lsb 02 2.0 full-scale error fse 2 / 1, 2, 3 01 5.0 lsb 02 3.0 full-scale error drift ? fse/ ? t 2 / 3 / 4 / 2, 3 all 4.0 lsb unipolar offset error voff 2 / 1, 2, 3 01 5.0 lsb 02 3.0 unipolar offset error drift ? voff/ ? t 2 / 3 / 4 / 2, 3 all 4.0 lsb bipolar offset error boff 2 / 1, 2, 3 01 5.0 lsb 02 3.0 bipolar offset error drift ? boff/ ? t 2 / 3 / 4 / 2, 3 all 4.0 lsb bipolar negative full-scale error bnfse 2 / 1, 2, 3 01 5.0 lsb 02 3.0 bipolar negative full-scale error drift ? bnfse/ ? t 2 / 3 / 4 / 2, 3 all 4.0 lsb digital input voltage v ih 5 / 6 / 7 / 1, 2, 3 all 2.0 v v il 0.8 digital input current i in 5 / 6 / 1, 2, 3 all 10 a digital output voltage v ol 5 / 6 / logic ?0?, i sink = -1.6 ma 1, 2, 3 all 0.4 v v oh 5 / 6 / logic ?1?, i source = 100 a +vd -1.0 positive analog supply current i a + 2 / 6 / 8 / +v a = 5.5 v dc 1, 2, 3 all 3.5 ma negative analog supply current i a - 2 / 6 / 8 / -v a = -5.5 v dc 1, 2, 3 all -3.5 ma positive digital supply current i d + 2 / 6 / 8 / +v d = 5.5 v dc 1, 2, 3 all 3.5 ma negative digital supply current i d - 2 / 6 / 8 / -v d = -5.5 v dc 1, 2, 3 all -2.5 ma analog input capacitance in fine charge mode c in 2 / 3 / unipolar mode 4 all 425 pf 2 / 3 / bipolar mode 265 see footnotes at end of table.
standard microcircuit drawing size a 5962-91692 defense supply center columbus columbus, ohio 43216-5000 revision level a sheet 7 dscc form 2234 apr 97 table i. electrical per formance characteristics ? continued. test symbol conditions -55 c t a +125 c unless otherwise specified group a subgroups device type 1 / limits unit min max peak harmonic or spurious noise s/pn 2 / 4, 5, 6 01 94 db 02 98 signal to noise ratio s/(n+d) 2 / 4, 5, 6 01 87 db 02 90 acquisition time t acq 2 / 3 / 9 / 9 all 9.375 s conversion time t c 2 / 6 / 9, 10, 11 all 40.63 s throughput f tp 2 / 6 / 9, 10, 11 all 20 khz rst pulse width t rst 3 / 5 / 10 / (see figure 3) 9, 10, 11 all 150 ns 2 / 1 ch edge to 1 trk , 2 trk , falling t dfsh4 5 / 6 / 10 / 11 / (see figure 4a) 9, 10, 11 all 68 t clk +260 ns hold to 1 trk , 2 trk , falling t dfsh1 5 / 6 / 10 / 12 / (see figure 4b) 9, 10, 11 all 66 t clk 68 t clk +260 ns hold pulse width t hold 5 / 6 / 10 / 12 / (see figure 5) 9, 10, 11 all 1 t clk +20 63 t clk ns hold to 2 / 1 ch edge t dhlri 5 / 6 / 10 / 12 / (see figure 5) 9, 10, 11 all 15 64 t clk ns hold falling to clkin falling t hcf 5 / 6 / 10 / 12 / (see figure 6) 9, 10, 11 all 95 1 t clk +10 ns sclk input pulse period t sclk 5 / 6 / 10 / (see figure 7a) pdt and rbt modes 9, 10, 11 all 200 ns sclk input pulse width low t sclkl 5 / 6 / 10 / (see figure 7) pdt and rbt modes 9, 10, 11 all 50 ns sclk input pulse width high t sclkh 5 / 6 / 10 / (see figure 7) pdt and rbt modes 9, 10, 11 all 50 ns sclk input falling to sdata valid t dss 5 / 6 / 10 / (see figures 7 and 8) pdt and rbt modes 9, 10, 11 all 150 ns sdata valid before rising sclk t ss 5 / 6 / 10 / (see figure 8b) frn and ssc modes 9, 10, 11 all 2 t clk -100 ns sdata valid after rising sclk t sh 5 / 6 / 10 / (see figure 7b) frn and ssc modes 9, 10, 11 all 2 t clk -100 ns last rising sclk to sdl rising t rsdl 5 / 6 / 10 / (see figure 7b) frn and ssc modes 9, 10, 11 all 2 t clk +200 ns hold falling to 1 st falling sclk t hfs 5 / 6 / 10 / (see figure 7b) frn and ssc modes 9, 10, 11 all 6 t clk 8 t clk +200 ns hold falling to sdata valid t dhs 5 / 6 / 10 / (see figure 8a) pdt mode 9, 10, 11 all 230 ns see footnotes at end of table.
standard microcircuit drawing size a 5962-91692 defense supply center columbus columbus, ohio 43216-5000 revision level a sheet 8 dscc form 2234 apr 97 table i. electrical per formance characteristics ? continued. test symbol conditions -55 c t a +125 c unless otherwise specified group a subgroups device type 1 / limits unit min max 1 trk , 2 trk falling to sdata valid t dts 5 / 6 / 10 / 13 / (see figure 8b) 9, 10, 11 all 125 ns clkin period t clk 3 / 5 / 6 / 10 / 14 / (see figure 6) 9, 10, 11 all 0.5 10 s clkin low time t clkl 5 / 6 / 10 / (see figure 6) 9, 10, 11 all 200 ns clkin high time t clkh 5 / 6 / 10 / (see figure 6) 9, 10, 11 all 200 ns 1 / the limiting terms ?min? (minimum ) and ?max? (maximum) s hall be considered to apply to magnitudes only. negative current shall be defined as conventional current flow out of a device terminal. 2 / unless otherwise specified, +v a , +v d = +5.0 v dc; -v a , -v d = -5.0 v dc; vref = +4.5 v dc; clkin = 1.6 mhz; f s = 20 khz; bipolar mode; frn mode; ain1 and ai n2 tied together; each channel tested separately; analog source impedance = 50 ? with 1000 pf to agnd; 200 hz full scale input sine wave; error tests are done after calibration at the temperature of interest; logic ?0? inputs are 0 v dc; logic ?1? inputs are +v d . 3 / this parameter shall be measured only for initial characterization and after process or design changes which may affect this parameter. 4 / total drift over -55 c to +125 c since calibration at power-up at +25 c . 5 / +v a , +v d = +5.0 v dc 10 percent; -v a , -v d = -5.0 v dc 10 percent. 6 / this parameter is guaranteed, if not tested, at t a = +25 c. this parameter is tested at t a = -55 c to +125 c. 7 / guaranteed at v ih = 2.0 v dc, v il = 0.8 v dc. tested at v ih = +v d , v il = 0 v dc. 8 / all outputs unloaded; inputs: logic ?0? = 0 v dc, logic ?1? = +v d . 9 / acquisition time is the time allowed by the converter for acquisition of the input voltage prior to conversion. 10 / inputs: logic ?0? = 0 v dc, logic ?1? = +v d ; c l = 50 pf. 11 / these times are for frn mode. 12 / these times are for ssc, pdt and rbt mode. 13 / only valid for 1 trk , 2 trk falling when sclk is low. if sclk is high when 1 trk , 2 trk falls, then sdata is valid t dss time after the next falling clock. 14 / clock speeds of less than 1.6 mhz, at temperatures > +100 c, will degrade dnl performance. minimum clkin period is 0.625 s in frn mode (20 khz sample rate).
standard microcircuit drawing size a 5962-91692 defense supply center columbus columbus, ohio 43216-5000 revision level a sheet 9 dscc form 2234 apr 97 device type 01 and 02 case outline x, 3 terminal number terminal symbol 1 -v d 2 rst 3 clkin 4 xout 5 stby 6 dgnd 7 +v d 8 1 trk 9 2 trk 10 crs/ fin 11 ssh/sdl 12 hold 13 ch1/ 2 14 sclk 15 sdata 16 code 17 bp/ up 18 outmod 19 ain1 20 v ref 21 refbuf 22 agnd 23 -v a 24 ain2 25 +v a 26 test 27 sckmod 28 sleep figure 1. terminal connections .
standard microcircuit drawing size a 5962-91692 defense supply center columbus columbus, ohio 43216-5000 revision level a sheet 10 dscc form 2234 apr 97 figure 2. block diagram .
standard microcircuit drawing size a 5962-91692 defense supply center columbus columbus, ohio 43216-5000 revision level a sheet 11 dscc form 2234 apr 97 figure 3. reset timing . figure 4. control output timing . figure 5. channel selection timing . figure 6. start conversion timing . note: all measurements taken at 50 percent of the rise and fall edges.
standard microcircuit drawing size a 5962-91692 defense supply center columbus columbus, ohio 43216-5000 revision level a sheet 12 dscc form 2234 apr 97 figure 7. serial data timing . figure 8. data transmission timing . note: all measurements taken at 50 percent of the rise and fall edges.
standard microcircuit drawing size a 5962-91692 defense supply center columbus columbus, ohio 43216-5000 revision level a sheet 13 dscc form 2234 apr 97 table ii. electrical test requirements . test requirements subgroups (in accordance with mil-std-883, method 5005, table i) subgroups (in accordance with mil-prf-38535, table iii) device class m device class q device class v interim electrical parameters (see 4.2) 1, 4 1, 4 1, 4 final electrical parameters (see 4.2) 1 / 1, 2, 3, 4, 5, 6, 10, 11 1 / 1, 2, 3, 4, 5, 6, 10, 11 1 / 1, 2, 3, 4, 5, 6, 10, 11 group a test requirements (see 4.4) 2 / 1, 2, 3, 4, 5, 6, 9, 10, 11 2 / 1, 2, 3, 4, 5, 6, 9, 10, 11 2 / 1, 2, 3, 4, 5, 6, 9, 10, 11 group c end-point electrical parameters (see 4.4) 1, 4, 9 1, 4, 9 1, 2, 3, 4, 5, 6, 9, 10, 11 group d end-point electrical parameters (see 4.4) 1, 4, 9 1, 4, 9 1, 4, 9 group e end-point electrical parameters (see 4.4) ------- ------- ------- 1 / pda applies to subgroup 1. 2 / subgroup 9 will be guaranteed if not tested. 4.3 qualification inspection for device classes q and v . qualification inspection for device classes q and v shall be in accordance with mil-prf-38535. inspections to be perform ed shall be those specified in mil-prf-38535 and herein for groups a, b, c, d, and e inspec tions (see 4.4.1 through 4.4.4). 4.4 conformance inspection . technology conformance inspection for cl asses q and v shall be in accordance with mil-prf-38535 including groups a, b, c, d, and e inspections and as specified herein. qualit y conformance inspection for device class m shall be in accordance with mil-prf-38535, appendi x a and as specified herein. inspections to be performed for device class m shall be those specified in method 5005 of mi l-std-883 and herein for groups a, b, c, d, and e inspections (see 4.4.1 through 4.4.4). 4.4.1 group a inspection . a. tests shall be as specified in table ii herein. b. subgroups 7 and 8 in table i, method 5005 of mil-std-883 shall be omitted. 4.4.2 group c inspection . the group c inspection end-point electrical param eters shall be as specified in table ii herein. 4.4.2.1 additional criteria for device class m . steady-state life test conditions, method 1005 of mil-std-883: a. test condition d. the test circuit shall be maintai ned by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in acco rdance with the intent specified in test method 1005 of mil-std-883. b. t a = +125 c, minimum. b. test duration: 1,000 hours, except as permitted by method 1005 of mil-std-883.
standard microcircuit drawing size a 5962-91692 defense supply center columbus columbus, ohio 43216-5000 revision level a sheet 14 dscc form 2234 apr 97 4.4.2.2 additional criteria for device classes q and v . the steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's qm plan in accordance with mil-prf-38535. the test circuit shall be maintained under document revision level c ontrol by the device manufacturer's trb in accordance with mil-prf-38535 and shall be made available to the acquiring or prepar ing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of mil-std-883. 4.4.3 group d inspection . the group d inspection end-point electrical param eters shall be as specified in table ii herein. 4.4.4 group e inspection . group e inspection is required only for par ts intended to be marked as radiation hardness assured (see 3.5 herein). a. end-point electrical parameters shall be as specified in table ii herein. b. for device classes q and v, the devices or test vehicl e shall be subjected to radiation hardness assured tests as specified in mil-prf-38535 for the rha level being tested. for device class m, the devices shall be subjected to radiation hardness assured tests as specified in mil- prf-38535, appendix a for the rha level being tested. all device classes must meet the postirradiation end-point el ectrical parameter limits as defined in table i at t a = +25 c 5 c, after exposure, to the subgroups specified in table ii herein. c. when specified in the purchase or der or contract, a copy of the rha delta limits shall be supplied. 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil-prf-38535 for device classes q and v or mil-prf-38535, appendix a for device class m. 6. notes 6.1 intended use . microcircuits conforming to this drawing are intended for use for gove rnment microcircuit applications (original equipment), design applic ations, and logistics purposes. 6.1.1 replaceability . microcircuits covered by this drawing will repl ace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 substitutability . device class q devices will replace device class m devices. 6.2 configuration control of smd's . all proposed changes to existing smd's will be coordinated with the users of record for the individual documents. this coordination will be accomplished using dd form 1692, engineering change proposal. 6.3 record of users . military and industrial users should inform de fense supply center columbus when a system application requires configuration control and which smd's are applic able to that system. dscc will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. users of drawings covering microelectronic devices (fsc 5962) shoul d contact dscc-va, telephone (614) 692-0544. 6.4 comments . comments on this drawing should be directed to dscc-va , columbus, ohio 43216-5000, or telephone (614) 692-0547. 6.5 abbreviations, symbols, and definitions . the abbreviations, symbols, and definitions used herein are defined in mil-prf-38535 and mil-hdbk-1331. 6.6 sources of supply . 6.6.1 sources of supply for device classes q and v . sources of supply for device classes q and v are listed in qml-38535. the vendors listed in qml-38535 have submitted a certificate of compliance (see 3.6 herein) to dscc-va and have agreed to this drawing. 6.6.2 approved sources of supply for device class m . approved sources of supply for cl ass m are listed in mil-hdbk-103. the vendors listed in mil-hdbk-103 have agreed to this drawi ng and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by dscc-va.
standard microcircuit drawing bulletin date: 02-04-18 approved sources of supply for smd 5962-91692 are listed below for immediate acquisition information only and shall be added to mil-hdbk-103 and qml-38535 during the next revision. mil-hdbk-103 and qml-38535 will be revised to include the addition or deletion of sources. the vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accept ed by dscc-va. this bulletin is superseded by the next dated revision of mil-hdbk-103 and qml-38535. standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-9169201mxa 68911 sei5102a-sdb 5962-9169201m3a 68911 sei5102a-seb 5962-9169202mxa 68911 sei5102a-tdb 5962-9169202m3a 68911 sei5102a-teb 1 / the lead finish shown for each pin representing a hermetic package is the most readily available from the manufacturer listed for that part. if the desired lead finish is not listed contact the vendor to determine its availability. 2 / caution . do not use this number for item acquisition. items acquired to this number may not satisfy the performance requirements of this drawing. vendor cage vendor name number and address 68911 maxwell technologies electronics components group, inc. 9244 balboa ave. san diego, ca 92123 the information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in the information bulletin.

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